Capabilities
The full sheet
Technical buyers scan a page like this to disqualify a supplier. Everything listed is something we can discuss in detail on a call — and where the honest answer is “partnered, not in-house”, it says so.
Silicon platforms
Vendor-neutral by construction — there is no module catalog here to steer you toward. The strongest depth is on Renesas RZ and ST, and the trade study comes before the schematic.
- Renesas RZ/V2M · RZ/V2MA Vision AI MPUs with DRP-AI accelerator
- Renesas RZ/V2L · RZ/V2N Entry vision AI, dual Cortex-A55
- Renesas RZ/G2L · RZ/G3E Industrial HMI, multimedia, energy-efficient
- Renesas RZ/N2L Industrial Ethernet and TSN networking
- Renesas RA8D1 · RA8D2 Cortex-M85 graphics MCUs to 1 GHz
- ST STM32MP2 Cortex-A35 applications MPU
- ST STM32H7 · H757 Flight-controller-class real-time MCU
- ST STM32L4 · STM32F1 Low-power and legacy control
- Espressif ESP32-S3-WROOM-1 Wi-Fi/BLE with camera pipeline
- NVIDIA Jetson Edge compute architecture and integration
- NXP i.MX · TI Sitara AM62 Evaluated and specified in trade studies
- Raspberry Pi CM ecosystem Carrier and HAT-format design
Module standards and form factors
Very few design houses at this scale can speak credibly about module standards. This is the narrowest, highest-intent territory Arcane occupies.
- SMARC 2.1 / 2.2 Module and carrier design, full pin-out compliance
- SGET OSM Open Standard Module, Size-S and Size-L stamps
- LGA System-on-Module Solder-down modules for cost and vibration
- OSM-to-SMARC adapters Evaluation and migration paths
- Single Board Computers Full-custom SBC design
- Raspberry Pi HAT / CM carriers RPi-format prototyping platforms
- CubePilot / Pixhawk Standard flight-controller carrier formats
- Pin-compatible families Drop-in upgrade paths across performance tiers
Interfaces and high-speed design
- DDR3 / DDR4 / LPDDR4 Fly-by topology, write levelling, length matching
- MIPI CSI-2 / DSI Camera and display, matched differential routing
- PCIe Gen2 / Gen3 AC coupling, via stub control, loss budget
- USB 2.0 / 3.x Return-path integrity, ESD placement
- Gigabit Ethernet, RGMII Magnetics placement, chassis isolation
- Industrial Ethernet, TSN EtherCAT and PROFINET adjacency
- eMMC, SD/SDIO, QSPI, OSPI NOR Boot and storage media
- CAN / CAN-FD Automotive and industrial control networks
- UART, SPI, I²C, I3C With correct level translation
- Controlled impedance Stack-up definition confirmed with the fabricator
RF, wireless and connectivity
- LoRa / LoRaWAN 868 MHz Long-range low-rate telemetry, duty-cycle and band planning
- Wi-Fi 6, Bluetooth LE Module integration, antenna placement, ground reference
- 5G / LTE cellular Transmit-transient budgeting against the rest of the power tree
- GNSS with RTK Antenna siting and reference cleanliness for autonomy-grade accuracy
- AIS reception Marine traffic awareness alongside other mast-mounted radiators
- RF-PLC hybrid Dual-path communications for smart grid and metering
- Antenna ports SMA and u.FL, 50 Ω feed calculation, keep-outs on every layer, ground stitching
- Co-existence Multiple radios in one enclosure, planned in the block diagram
- Regulatory Sub-GHz ISM band planning by target market
Power electronics and battery systems
- Power tree design Input rail to every load, with transient headroom at worst-case ambient
- Topology selection Buck, boost and buck-boost; magnetics sizing against the real duty cycle
- Sequencing Ordering that meets each device power-up specification exactly
- Reverse blocking and hot-plug Ideal-diode control, inrush limiting, LC ringing mitigation
- Hold-up and dying-gasp Energy sized against the longest realistic write, not a rule of thumb
- Battery front-end High-side switching, protection, fuel-gauge interface, cell balancing adjacency
- Current and temperature sensing Isolated Hall and shunt paths with a measurement chain you can trust
- Mechanical derating Soft-termination ceramics where board flex or impact is real
- Low-power and always-on Quiescent budgets, wake sources, sleep-state current that survives the whole design
- Isolation Isolated rails and creepage-aware layout where the application demands it
Sensors and sensing
- Inertial measurement Dual-source footprints, external clocking, vibration-aware mounting
- LiDAR and time-of-flight Selection screened on range, interface, ingress rating and availability
- mmWave radar Presence detection, zone configuration, antenna keep-out discipline
- Camera pipelines MIPI CSI-2 lane matching and a clean ISP reference
- Optical sensing Turbidity and reflective measurement with controlled illumination
- Environmental Barometric, temperature and humidity with a usable analogue path
- Redundancy Second-source architecture where a single sensor is a program risk
Motor control and actuation
- BLDC drive integration VESC-class controllers over UART and CAN
- Precision brushed drives Positioning axes with current and thermal headroom
- Field-oriented control Adjacency and integration
- Driver board bring-up Commissioning, current limits set to what the mechanics survive
- Stall and fault behavior Defined failure response rather than discovered failure response
Embedded software
Scoped honestly. Where the hardware was ours and the software stack was the client’s, the software is not claimed. AUTOSAR classic and FPGA RTL are partnered, not pretended.
- BSP enablement Hardware designed so mainline or vendor BSP boots
- Board bring-up and validation JTAG / SWD debug, interface proving
- Bootloader and flashing U-Boot level, production programming infrastructure
- MCU firmware STM32, ESP32 — drivers, comms, sensor integration
- Yocto / Buildroot Ecosystem familiarity, build integration
- Zephyr, FreeRTOS RTOS-based product firmware
- ArduPilot / PX4 / MAVLink From flight-controller carrier work
- ROS / ROS 2 Adjacency for robotics and USV autonomy
Standards, compliance and quality
- IEC 60601-1 Medical electrical equipment constraints
- EN 55032 / EN 55035 EMC pre-compliance, CE marking pathway
- IPC-2221 / IPC-2152 Design rules and current-carrying capacity
- IPC-A-610 Assembly acceptance classes
- AEC-Q100 / Q101 Automotive-grade component selection
- RoHS / REACH Material compliance in BOM engineering
- Shield termination 360° termination, chassis grounding, harness design
- Traceability Requirements documentation and review packages
Manufacturing and supply chain
- DFM / DFA / DFT review Against your fabricator’s real capability sheet
- Eurocircuits and EU fabrication Including rigid-flex and semi-flex
- Rigid-flex stack-ups Bend-radius calculation, layer transitions
- HDI, blind and buried vias Layer-count optimization
- BOM engineering Cost-down to unit targets at volume
- Second sourcing Shortage mitigation, obsolescence management
- Output formats Gerber X2, ODB++, IPC-2581, assembly drawings, panelization
- Enclosure interface Connector selection, ODU, cable assemblies
- Rapid prototyping 3D printing in PC and engineering filaments
Tools and workflow
- Altium Designer Primary EDA for dense high-speed work
- KiCad Where you want a toolchain your team owns
- Hierarchical multi-sheet schematics Reviewable by your engineers
- Git-based hardware version control Every revision diffable and attributable
- SPICE simulation Adjacency for analogue and power validation
- Structured estimation Task-level person-day breakdowns, not ranges
Sectors
- UAV and drone electronics Fixed-wing, tube-launched, flight controllers, carriers
- Unmanned surface vessels Marine autonomy, edge compute, AIS and GNSS
- Robotics Including competitive robotics
- Industrial automation and HMI Panel and control applications
- Industrial IoT and edge AI Vision inference at the edge
- Smart energy and metering Grid, RF-PLC, smart metering
- Medical devices IEC 60601-1 class, peritoneal dialysis
- Automotive-adjacent AEC-Q qualified selection
Something not on the list?
Ask. If it's outside what we do, we'll say so and point you at someone who does it properly — that's a faster answer than three weeks of discovery.