SGET OSM modules — Size-S and Size-L
Soldered down rather than plugged in: no connector cost, no connector height, and nothing to unseat under vibration.
Fit
When this is the right choice
Choose it when
- The product is subject to shock or vibration
- Z-height is constrained and a connector stack will not fit
- Volume is high enough that connector cost matters on every unit
- Service is centralized — failed units come back rather than being repaired on site
Look elsewhere when
- Field-replaceability is a product requirement
- You are early in development and will swap modules frequently
- Your assembler cannot reliably reflow a module onto a populated carrier
Engineering
What’s actually hard about it
The parts that decide whether it works on the first spin, and the parts that cost a respin when they are wrong.
Test strategy changes completely
Once reflowed, module and carrier cannot be separated to isolate a fault. Test-point coverage and boundary-scan access have to be designed in from the start.
Reflow profile on a populated board
Attaching a module to a carrier that already has parts on it is a real process engineering question, not an afterthought.
Rework cost
Replacing a module risks the carrier. That changes the economics of a failure and should shape your test coverage.
Size boundary decisions
Size-S suits MCU-class and entry MPU designs; Size-L carries a full applications processor. Running out of pins late is far more expensive than the extra area.
What we have built on it
OSM Size-S and Size-L stamps with full-break-out evaluation boards, an OSM-to-SMARC adapter for evaluation on existing carriers, and a Raspberry Pi format carrier.
Relevant services: System-on-Module design Carrier board design
Got a board to design — or one that won’t boot?
You talk to the engineer who would do the work. Reply within one business day, and we’ll sign your NDA before you go into detail.