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Platforme siliciu
- Renesas RZ/V2M · RZ/V2MA Vision AI MPUs with DRP-AI accelerator
- Renesas RZ/V2L · RZ/V2N Entry vision AI, dual Cortex-A55
- Renesas RZ/G2L · RZ/G3E Industrial HMI, multimedia, energy-efficient
- Renesas RZ/N2L Industrial Ethernet and TSN networking
- Renesas RA8D1 · RA8D2 Cortex-M85 graphics MCUs to 1 GHz
- ST STM32MP2 Cortex-A35 applications MPU
- ST STM32H7 · H757 Flight-controller-class real-time MCU
- ST STM32L4 · STM32F1 Low-power and legacy control
- Espressif ESP32-S3-WROOM-1 Wi-Fi/BLE with camera pipeline
- NVIDIA Jetson Edge compute architecture and integration
- NXP i.MX · TI Sitara AM62 Evaluated and specified in trade studies
- Raspberry Pi CM ecosystem Carrier and HAT-format design
Standarde de module
- SMARC 2.1 / 2.2 Module and carrier design, full pin-out compliance
- SGET OSM Open Standard Module, Size-S and Size-L stamps
- LGA System-on-Module Solder-down modules for cost and vibration
- OSM-to-SMARC adapters Evaluation and migration paths
- Single Board Computers Full-custom SBC design
- Raspberry Pi HAT / CM carriers RPi-format prototyping platforms
- CubePilot / Pixhawk Standard flight-controller carrier formats
- Pin-compatible families Drop-in upgrade paths across performance tiers
Interfețe și design de mare viteză
- DDR3 / DDR4 / LPDDR4 Fly-by topology, write levelling, length matching
- MIPI CSI-2 / DSI Camera and display, matched differential routing
- PCIe Gen2 / Gen3 AC coupling, via stub control, loss budget
- USB 2.0 / 3.x Return-path integrity, ESD placement
- Gigabit Ethernet, RGMII Magnetics placement, chassis isolation
- Industrial Ethernet, TSN EtherCAT and PROFINET adjacency
- eMMC, SD/SDIO, QSPI, OSPI NOR Boot and storage media
- CAN / CAN-FD Automotive and industrial control networks
- UART, SPI, I²C, I3C With correct level translation
- Controlled impedance Stack-up definition confirmed with the fabricator
RF, wireless și conectivitate
- LoRa / LoRaWAN 868 MHz Long-range low-rate telemetry, duty-cycle and band planning
- Wi-Fi 6, Bluetooth LE Module integration, antenna placement, ground reference
- 5G / LTE cellular Transmit-transient budgeting against the rest of the power tree
- GNSS with RTK Antenna siting and reference cleanliness for autonomy-grade accuracy
- AIS reception Marine traffic awareness alongside other mast-mounted radiators
- RF-PLC hybrid Dual-path communications for smart grid and metering
- Antenna ports SMA and u.FL, 50 Ω feed calculation, keep-outs on every layer, ground stitching
- Co-existence Multiple radios in one enclosure, planned in the block diagram
- Regulatory Sub-GHz ISM band planning by target market
Electronică de putere și sisteme de baterii
- Power tree design Input rail to every load, with transient headroom at worst-case ambient
- Topology selection Buck, boost and buck-boost; magnetics sizing against the real duty cycle
- Sequencing Ordering that meets each device power-up specification exactly
- Reverse blocking and hot-plug Ideal-diode control, inrush limiting, LC ringing mitigation
- Hold-up and dying-gasp Energy sized against the longest realistic write, not a rule of thumb
- Battery front-end High-side switching, protection, fuel-gauge interface, cell balancing adjacency
- Current and temperature sensing Isolated Hall and shunt paths with a measurement chain you can trust
- Mechanical derating Soft-termination ceramics where board flex or impact is real
- Low-power and always-on Quiescent budgets, wake sources, sleep-state current that survives the whole design
- Isolation Isolated rails and creepage-aware layout where the application demands it
Senzori
- Inertial measurement Dual-source footprints, external clocking, vibration-aware mounting
- LiDAR and time-of-flight Selection screened on range, interface, ingress rating and availability
- mmWave radar Presence detection, zone configuration, antenna keep-out discipline
- Camera pipelines MIPI CSI-2 lane matching and a clean ISP reference
- Optical sensing Turbidity and reflective measurement with controlled illumination
- Environmental Barometric, temperature and humidity with a usable analogue path
- Redundancy Second-source architecture where a single sensor is a program risk
Control motoare
- BLDC drive integration VESC-class controllers over UART and CAN
- Precision brushed drives Positioning axes with current and thermal headroom
- Field-oriented control Adjacency and integration
- Driver board bring-up Commissioning, current limits set to what the mechanics survive
- Stall and fault behavior Defined failure response rather than discovered failure response
Software embedded
- BSP enablement Hardware designed so mainline or vendor BSP boots
- Board bring-up and validation JTAG / SWD debug, interface proving
- Bootloader and flashing U-Boot level, production programming infrastructure
- MCU firmware STM32, ESP32 — drivers, comms, sensor integration
- Yocto / Buildroot Ecosystem familiarity, build integration
- Zephyr, FreeRTOS RTOS-based product firmware
- ArduPilot / PX4 / MAVLink From flight-controller carrier work
- ROS / ROS 2 Adjacency for robotics and USV autonomy
Standarde și conformitate
- IEC 60601-1 Medical electrical equipment constraints
- EN 55032 / EN 55035 EMC pre-compliance, CE marking pathway
- IPC-2221 / IPC-2152 Design rules and current-carrying capacity
- IPC-A-610 Assembly acceptance classes
- AEC-Q100 / Q101 Automotive-grade component selection
- RoHS / REACH Material compliance in BOM engineering
- Shield termination 360° termination, chassis grounding, harness design
- Traceability Requirements documentation and review packages
Producție și lanț de aprovizionare
- DFM / DFA / DFT review Against your fabricator’s real capability sheet
- Eurocircuits and EU fabrication Including rigid-flex and semi-flex
- Rigid-flex stack-ups Bend-radius calculation, layer transitions
- HDI, blind and buried vias Layer-count optimization
- BOM engineering Cost-down to unit targets at volume
- Second sourcing Shortage mitigation, obsolescence management
- Output formats Gerber X2, ODB++, IPC-2581, assembly drawings, panelization
- Enclosure interface Connector selection, ODU, cable assemblies
- Rapid prototyping 3D printing in PC and engineering filaments
Unelte și flux de lucru
- Altium Designer Primary EDA for dense high-speed work
- KiCad Where you want a toolchain your team owns
- Hierarchical multi-sheet schematics Reviewable by your engineers
- Git-based hardware version control Every revision diffable and attributable
- SPICE simulation Adjacency for analogue and power validation
- Structured estimation Task-level person-day breakdowns, not ranges
Domenii
- UAV and drone electronics Fixed-wing, tube-launched, flight controllers, carriers
- Unmanned surface vessels Marine autonomy, edge compute, AIS and GNSS
- Robotics Including competitive robotics
- Industrial automation and HMI Panel and control applications
- Industrial IoT and edge AI Vision inference at the edge
- Smart energy and metering Grid, RF-PLC, smart metering
- Medical devices IEC 60601-1 class, peritoneal dialysis
- Automotive-adjacent AEC-Q qualified selection
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