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Platforme siliciu
- Renesas RZ/V2M · RZ/V2MA Vision AI MPUs with DRP-AI accelerator
- Renesas RZ/V2L · RZ/V2N Entry vision AI, dual Cortex-A55
- Renesas RZ/G2L · RZ/G3E Industrial HMI, multimedia, energy-efficient
- Renesas RZ/N2L Industrial Ethernet and TSN networking
- Renesas RA8D1 · RA8D2 Cortex-M85 graphics MCUs to 1 GHz
- ST STM32MP2 Cortex-A35 applications MPU
- ST STM32H7 · H757 Flight-controller-class real-time MCU
- ST STM32L4 · STM32F1 Low-power and legacy control
- Espressif ESP32-S3-WROOM-1 Wi-Fi/BLE with camera pipeline
- NVIDIA Jetson Edge compute architecture and integration
- NXP i.MX · TI Sitara AM62 Evaluated and specified in trade studies
- Raspberry Pi CM ecosystem Carrier and HAT-format design
Standarde de module
- SMARC 2.1 / 2.2 Module and carrier design, full pin-out compliance
- SGET OSM Open Standard Module, Size-S and Size-L stamps
- LGA System-on-Module Solder-down modules for cost and vibration
- OSM-to-SMARC adapters Evaluation and migration paths
- Single Board Computers Full-custom SBC design
- Raspberry Pi HAT / CM carriers RPi-format prototyping platforms
- CubePilot / Pixhawk Standard flight-controller carrier formats
- Pin-compatible families Drop-in upgrade paths across performance tiers
Interfețe și design de mare viteză
- DDR3 / DDR4 / LPDDR4 Fly-by topology, write levelling, length matching
- MIPI CSI-2 / DSI Camera and display, matched differential routing
- PCIe Gen2 / Gen3 AC coupling, via stub control, loss budget
- USB 2.0 / 3.x Return-path integrity, ESD placement
- Gigabit Ethernet, RGMII Magnetics placement, chassis isolation
- Industrial Ethernet, TSN EtherCAT and PROFINET adjacency
- eMMC, SD/SDIO, QSPI, OSPI NOR Boot and storage media
- CAN / CAN-FD Automotive and industrial control networks
- UART, SPI, I²C, I3C With correct level translation
- Controlled impedance Stack-up definition confirmed with the fabricator
RF, wireless și conectivitate
- LoRa / LoRaWAN 868 MHz Würth Daphnis-I
- Wi-Fi 6, Bluetooth LE 5.1 Module integration and antenna placement
- 5G / LTE cellular Quectel RM520N-GL
- GNSS and RTK Septentrio Mosaic-X5, u-blox ZED-F9P
- AIS reception Comar R400NG, marine traffic
- RF-PLC hybrid Smart grid and smart metering
- SMA and u.FL antenna ports 50 Ω trace calculation, RF keep-outs, ground stitching
- Sub-GHz ISM Regulatory band planning by target market
Electronică de putere și sisteme de baterii
- Buck converters TPS54360, TPS560430
- Boost converters LT8330, TPS61023
- Ideal-diode / reverse blocking LM74700-Q1
- Hold-up and dying-gasp MPS MP5515, graceful shutdown
- BMS front-end BQ76200 high-side driver, PSMN1R0-60YS
- Current sensing ACS770 Hall-effect
- Li-ion charging MCP73831
- Isolated modules / BEC TDK-Lambda
- Hot-plug survivability Inrush limiting, LC ringing mitigation, soft-termination MLCC
- Low-power and always-on LDO selection, power sequencing, sleep budgets
Senzori
- IMU integration ICM-45686, ICM-42688, ISM330DHCX — dual-source footprints, external 32.768 kHz
- LiDAR and time-of-flight Benewake and a surveyed field of 20+ vendors
- mmWave radar Presence detection, zone configuration
- Camera modules OV5640, MIPI camera pipelines
- Optical turbidity IR and green LED illumination
- Barometric pressure Altitude and environmental sensing
Control motoare
- VESC-based BLDC control UART and CAN command interfaces
- Brushed drives Maxon RE35
- Field-oriented control Adjacency and integration
- Driver board bring-up Firmware migration and validation
Software embedded
- BSP enablement Hardware designed so mainline or vendor BSP boots
- Board bring-up and validation JTAG / SWD debug, interface proving
- Bootloader and flashing U-Boot level, production programming infrastructure
- MCU firmware STM32, ESP32 — drivers, comms, sensor integration
- Yocto / Buildroot Ecosystem familiarity, build integration
- Zephyr, FreeRTOS RTOS-based product firmware
- ArduPilot / PX4 / MAVLink From flight-controller carrier work
- ROS / ROS 2 Adjacency for robotics and USV autonomy
Standarde și conformitate
- IEC 60601-1 Medical electrical equipment constraints
- EN 55032 / EN 55035 EMC pre-compliance, CE marking pathway
- IPC-2221 / IPC-2152 Design rules and current-carrying capacity
- IPC-A-610 Assembly acceptance classes
- AEC-Q100 / Q101 Automotive-grade component selection
- RoHS / REACH Material compliance in BOM engineering
- Shield termination 360° termination, chassis grounding, harness design
- Traceability Requirements documentation and review packages
Producție și lanț de aprovizionare
- DFM / DFA / DFT review Against your fabricator’s real capability sheet
- Eurocircuits and EU fabrication Including rigid-flex and semi-flex
- Rigid-flex stack-ups Bend-radius calculation, layer transitions
- HDI, blind and buried vias Layer-count optimization
- BOM engineering Cost-down to unit targets at volume
- Second sourcing Shortage mitigation, obsolescence management
- Output formats Gerber X2, ODB++, IPC-2581, assembly drawings, panelization
- Enclosure interface Connector selection, ODU, cable assemblies
- Rapid prototyping 3D printing in PC and engineering filaments
Unelte și flux de lucru
- Altium Designer Primary EDA for dense high-speed work
- KiCad Where you want a toolchain your team owns
- Hierarchical multi-sheet schematics Reviewable by your engineers
- Git-based hardware version control Every revision diffable and attributable
- SPICE simulation Adjacency for analogue and power validation
- Structured estimation Task-level person-day breakdowns, not ranges
Domenii
- UAV and drone electronics Fixed-wing, tube-launched, flight controllers, carriers
- Unmanned surface vessels Marine autonomy, edge compute, AIS and GNSS
- Robotics Including competitive robotics
- Industrial automation and HMI Panel and control applications
- Industrial IoT and edge AI Vision inference at the edge
- Smart energy and metering Grid, RF-PLC, smart metering
- Medical devices IEC 60601-1 class, peritoneal dialysis
- Automotive-adjacent AEC-Q qualified selection
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